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Verleimprofil-Wendeplatten HW ID 165911
Verleimprofil-ECOM
LOG_FIR_LEUCO-DUR-Katalog-w_#SALL_#AIN_#V1.png

Produktvarianten

Produktvarianten
SB1 IMD H T BD Mat.-Nr.
60 4 21,6 2 32 165909
50 4 21,6 2 26 165911
50 4 23 2 26 180431
60 4 23 2 36 180432

Bildlegende

  • GRA_MKM_FBJ_FBJ-B31_#SALL_#AIN_#V1.png
    Schnittbreite 1
  • GRA_MKM_SPJ_SPJ-L1_#SALL_#AIN_#V1.png
    Bohrungsabstand
  • GRA_MKM_ALG_IMD-ITD_#SALL_#AIN_#V1.png
    Bohrungs-/ Schaftdurchmesser
  • GRA_MKM_SPJ_SPJ-S1_#SALL_#AIN_#V1.png
    Dicke
  • GRA_MKM_FBJ_FBJ-H11_#SALL_#AIN_#V1.png
    Höhe

Produktdetails

Anwendung
for use in glue joint cutterheads
Ausführung
cutting material: HW
HL Board 05 for wood-based panels, plastics and hard woods
HL Solid 20 for hard and soft woods
Vorteile
very accurate profiling for optimum glue joints

Downloads