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![192609]()
Sizing Saw Blades HW 'TR-F' - magnet bond boards
ID
192609
Product variants
Product variants
| DA | SB1 | IML | IMD | Z | NL | W_Span | Material number |
|---|---|---|---|---|---|---|---|
| 350 | 3.2 | 2.5 | 30 | 110 | 2/7/42 + 2/9/46 + 2/10/60 | 5 | 192609 |
| 350 | 4.4 | 3.2 | 30 | 72 | 10 | 192610 |
Image Legend
-
Cutting width 1 -
Pin holes -
Hook angle -
Bore / shank diameter -
Clamping length -
Number of teeth -
Diameter - Outermost cutting point
Product Details
Maschine
table saws
horizontal panel sizing saws
horizontal panel sizing saws
Application
for sizing cuts in magnet bond boards or panels with thin steel foils
for single or stack cuts
for single or stack cuts
Design
tooth configuration: triple chip / flat "TR-F"
cutting material: special HW grade HL Steel 17
cutting material: special HW grade HL Steel 17
Advantages
noise reduction thanks to laser ornaments
spark-reduced cutting
spark-reduced cutting
Diameter - Outermost cutting point
350
Cutting width 1
3.2
Clamping length
2.5
Bore / shank diameter
30
Number of teeth
110
Tooth configuration
Trapezzahn + Flachzahn
Pin holes
2/7/42 + 2/9/46 + 2/10/60
RPM max
005500
Cutting direction
universal
Cutting material group
Hardmetal
Cutting material specification
HL Steel17
Machine group
sawing machines
Machine type
Table and sizing saw-main saw
Machine / Aggregate
Misc. clipping and miter saws
Altendorf main saw
Bäuerle main saw
Felder main saw
Hokubema main saw
Format 4 Main saw
Panhans Main saw
SCM Main saw
Martin main saw
Scheer FM
Koelle main saw
Lohmeyer main saw
Altendorf main saw
Bäuerle main saw
Felder main saw
Hokubema main saw
Format 4 Main saw
Panhans Main saw
SCM Main saw
Martin main saw
Scheer FM
Koelle main saw
Lohmeyer main saw
Brand name LEUCO
LEUCODUR
Quality level LEUCO
LEUCO topline
Workpiece material
Metals
special manufacturermaterials
special manufacturermaterials
Workpiece type
Composite material
Composite materials
RESOPAL
Composite materials
RESOPAL
Workpiece material
Iron covered particle board
Magnet bond board
Magnet bond board