Maschine
edge banding machines
Application
for noise-reduced, chip-free jointing of melamine-, paper-, HPL-laminated, foiled and veneered panels
Design
symmetrical and asymmetrical design
large opposing shear angle
uneven cutting edge configuration
resharpening area 3 mm
large opposing shear angle
uneven cutting edge configuration
resharpening area 3 mm
Advantages
optimized chip removal thanks to ChipMeister version
less chips remain inside of the machine
no malfunctions due to chips
reduction of suction power
optimal glueing of edges
optimized as to noise level and chip flow
excellent cutting quality even in the case of loose core
suitable for laser-edge-technology
less chips remain inside of the machine
no malfunctions due to chips
reduction of suction power
optimal glueing of edges
optimized as to noise level and chip flow
excellent cutting quality even in the case of loose core
suitable for laser-edge-technology
Notes
sense of rotation according to VDMA 8849